Last week, compact server RAM modules, SOCAMM 2 (Small Outline Compression Attached Memory Modules), were announced. They are designed for use in servers deploying AI.
These modules are built on LPDDR5X chips, renowned for their energy efficiency, and offer a capacity of 192GB.
This is the second generation of SOCAMM memory; the first was announced in March of this year. These modules measure 14 x 90mm.
The first generation modules were created using 1β DRAM technology, which is part of the fifth generation of the 10nm class. Their capacity was 128GB. SOCAMM2, however, is created using Micron’s more innovative 1γ DRAM technology, which, unlike its predecessor, is part of the sixth generation of the 10nm class. The capacity of the new modules has increased by 1.5 times compared to previous models, while maintaining the same dimensions. Efficiency has been increased by more than 19%. Compared to a similar DDR5 RDIMM solution, power efficiency has been improved by more than 60%.
The data transfer rate is claimed to be 9.6 Gbps per contact.
Official picture from micron site
Also, according to Micron themselves, although LPDDR5X was initially developed as a solution for smartphones, they have effectively optimized it for server use.
However, the modular design of SOCAMM2 and its new stacking technology also improve serviceability and operation, and simplify the design of servers with liquid cooling.
Trial runs of SOCAMM2 are already in limited use with Micron’s partners.
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